Tech Specs

Our in-house developed camera device with built-in AI accelerator

SoC Qualcomm Snapdragon 865
with built-in AI accelerator

Multiple Lens Choice Available
up to 48 MP

Finish

White
Aluminium

Size and Weight

Dimension
Φ 153.4 × 133.1 mm (Φ 6″ × 5.2″)

Weight
1300 g (2.9 lb.), With package: 1500 g (3.3 lb.)

In the Box

teye Dome Camera
User Manual

Capacity

60 Days of Onboard Retention

Chip

Qualcomm® Snapdragon™ 865 mobile platform
Octa-core up to 2.84 GHz

AI Accelerator

19 trillion operations per second

Camera

48MP Wide camera
ƒ/1.8 aperture
Fixed focus
Night mode
Exposure control
Noise reduction
Smart HDR
Image formats captured: HEIF and JPEG
Qualcomm Spectra 480 image signal processor
Hardware accelerator for computer vision (CV-ISP)

Video Recording

4K video recording at 24 fps, 30 fps, or 60 fps
4K video capture with simultaneous 48 MP photo capture
Noise reduction
Video formats captured: H.265 and H.264
AI Auto-exposure

Microphone / Noise

Omnidirectional (not recording)

Conectivity

Ethernet
802.11ax Wi-Fi 6; simultaneous dual band (2.4GHz and 5GHz);
Bluetooth 5.1 technology
5G

Location

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, Dual frequency GNSS
Wi‑Fi
Cellular

Sensors

Three‐axis gyro
Accelerometer
Barometer

SIM Card

eSIM

Power

PoE
12V DC ±30%
Max 12.5W (12V DC, IR on)

Splash and Dust Resistant

Rated IP68

Device Operating System

Linux / Android

Environmental Requirements

Operating temperature: -13° to 158° F (-25° to 70° C)
Operating altitude: tested up to 10,000 feet (3000 m)

Languages

Language support
English (Australia, UK, U.S.)